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If using the Government Microelectronics Assessment for Trust (GOMAT) framework outright, to perform ASIC and FPGA threat/vulnerability risk assessment, the following requirements would apply: {SV-SP-5}{SR-1,SR-5}
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• 1.g “In coordination with the DOD CIO, the Director, Defense Intelligence Agency (DIA), and the Heads of the DOD Components, develop a strategy for managing risk in the supply chain for integrated circuit-related products and services (e.g., FPGAs, printed circuit boards) that are identifiable to the supplier as specifically created or modified for DOD (e.g., military temperature range, radiation hardened).
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For FPGA pre-silicon artifacts that are developed, coded, and tested by a developer that is not accredited, the [organization] shall be subjected to a development environment and pre-silicon artifacts risk assessment by [organization]. Based on the results of the risk assessment, the [organization] may need to implement protective measures or other processes to ensure the integrity of the FPGA pre-silicon artifacts.{SV-SP-5}{SA-3,SA-3(1),SA-8(9),SA-8(11),SA-12,SA-12(1),SR-1,SR-5}
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DOD-I-5200.44 requires the following:
4.c.2 “Control the quality, configuration, and security of software, firmware, hardware, and systems throughout their lifecycles... Employ protections that manage risk in the supply chain… (e.g., integrated circuits, field-programmable gate arrays (FPGA), printed circuit boards) when they are identifiable (to the supplier) as having a DOD end-use. “ 4.e “In applicable systems, integrated circuit-related products and services shall be procured from a Trusted supplier accredited by the Defense Microelectronics Activity (DMEA) when they are custom-designed, custommanufactured, or tailored for a specific DOD military end use (generally referred to as application-specific integrated circuits (ASIC)). “ 1.g “In coordination with the DOD CIO, the Director, Defense Intelligence Agency (DIA), and the Heads of the DOD Components, develop a strategy for managing risk in the supply chain for integrated circuit-related products and services (e.g., FPGAs, printed circuit boards) that are identifiable to the supplier as specifically created or modified for DOD (e.g., military temperature range, radiation hardened).
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Any EEEE or mechanical piece parts that cannot be procured from the OCM or their authorized distribution network shall be approved and the government program office notified to prevent and detect counterfeit and fraudulent parts and materials.{SV-SP-5}{SA-8(9),SA-8(11),SA-12,SA-12(1),SR-1,SR-5}
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The Program, working with the contractors, shall identify which ASICs/FPGAs perform or execute an integral part of mission critical functions and if the supplier is accredited “Trusted” by DMEA. If the contractor is not accredited by DMEA, then the Program may apply various of the below ASIC/FPGA assurance requirements to the contractor, and the Program may need to perform a risk assessment of the contractor’s design environment.
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For ASICs that are designed, developed, manufactured, packaged, or tested by a supplier that is not DMEA accredited, the ASIC development shall undergo a threat/vulnerability risk assessment. Based on the results of the risk assessment, the [organization] may need to implement protective measures or other processes to ensure the integrity of the ASIC.{SV-SP-5}{SA-8(9),SA-8(11),SA-8(21),SA-12,SA-12(1),SR-1,SR-4(4),SR-5}
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DOD-I-5200.44 requires the following:
4.c.2 “Control the quality, configuration, and security of software, firmware, hardware, and systems throughout their lifecycles... Employ protections that manage risk in the supply chain… (e.g., integrated circuits, field-programmable gate arrays (FPGA), printed circuit boards) when they are identifiable (to the supplier) as having a DOD end-use. “ 4.e “In applicable systems, integrated circuit-related products and services shall be procured from a Trusted supplier accredited by the Defense Microelectronics Activity (DMEA) when they are custom-designed, custommanufactured, or tailored for a specific DOD military end use (generally referred to as application-specific integrated circuits (ASIC)). “ 1.g “In coordination with the DOD CIO, the Director, Defense Intelligence Agency (DIA), and the Heads of the DOD Components, develop a strategy for managing risk in the supply chain for integrated circuit-related products and services (e.g., FPGAs, printed circuit boards) that are identifiable to the supplier as specifically created or modified for DOD (e.g., military temperature range, radiation hardened).
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Any EEEE or mechanical piece parts that cannot be procured from the OCM or their authorized franchised distribution network shall be approved by the [organization]’s Parts, Materials and Processes Control Board (PMPCB) as well as the government program office to prevent and detect counterfeit and fraudulent parts and materials.{SV-SP-5}{SR-1,SR-5}
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The Program, working with the contractors, shall identify which ASICs/FPGAs perform or execute an integral part of mission critical functions and if the supplier is accredited “Trusted” by DMEA. If the contractor is not accredited by DMEA, then the Program may apply various of the below ASIC/FPGA assurance requirements to the contractor, and the Program may need to perform a risk assessment of the contractor’s design environment.
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For ASICs that are designed, developed, manufactured, packaged, or tested by a supplier that is NOT DMEA accredited Trusted, the ASIC development shall undergo a threat/vulnerability risk assessment.The assessment shall use Aerospace security guidance and requirements tailored from TOR-2019-00506 Vol.2, and TOR-2019-02543 ASIC and FPGA Risk Assessment Process and Checklist.Based on the results of the risk assessment, the Program may require the developer to implement protective measures or other processes to ensure the integrity of the ASIC.{SV-SP-5}{SR-1,SR-5}
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DOD-I-5200.44 requires the following:
4.c.2 “Control the quality, configuration, and security of software, firmware, hardware, and systems throughout their lifecycles... Employ protections that manage risk in the supply chain… (e.g., integrated circuits, field-programmable gate arrays (FPGA), printed circuit boards) when they are identifiable (to the supplier) as having a DOD end-use. “ 4.e “In applicable systems, integrated circuit-related products and services shall be procured from a Trusted supplier accredited by the Defense Microelectronics Activity (DMEA) when they are custom-designed, custommanufactured, or tailored for a specific DOD military end use (generally referred to as application-specific integrated circuits (ASIC)). “ 1.g “In coordination with the DOD CIO, the Director, Defense Intelligence Agency (DIA), and the Heads of the DOD Components, develop a strategy for managing risk in the supply chain for integrated circuit-related products and services (e.g., FPGAs, printed circuit boards) that are identifiable to the supplier as specifically created or modified for DOD (e.g., military temperature range, radiation hardened).
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For FPGA pre-silicon artifacts that are developed, coded, and tested by a developer that is NOT DMEA accredited Trusted, the contractor/developer shall be subjected to a development environment and pre-silicon artifacts risk assessment by the Program.The assessment shall use Aerospace security guidance and requirements in TOR-2019-00506 Vol.2, and TOR-2019-02543 ASIC and FPGA Risk Assessment Process and Checklist.Based on the results of the risk assessment, the Program may require the developer to implement protective measures or other processes to ensure the integrity of the FPGA pre-silicon artifacts.{SV-SP-5}{SR-1,SR-5}
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DOD-I-5200.44 requires the following:
4.c.2 “Control the quality, configuration, and security of software, firmware, hardware, and systems throughout their lifecycles... Employ protections that manage risk in the supply chain… (e.g., integrated circuits, field-programmable gate arrays (FPGA), printed circuit boards) when they are identifiable (to the supplier) as having a DOD end-use. “ 4.e “In applicable systems, integrated circuit-related products and services shall be procured from a Trusted supplier accredited by the Defense Microelectronics Activity (DMEA) when they are custom-designed, custommanufactured, or tailored for a specific DOD military end use (generally referred to as application-specific integrated circuits (ASIC)). “ 1.g “In coordination with the DOD CIO, the Director, Defense Intelligence Agency (DIA), and the Heads of the DOD Components, develop a strategy for managing risk in the supply chain for integrated circuit-related products and services (e.g., FPGAs, printed circuit boards) that are identifiable to the supplier as specifically created or modified for DOD (e.g., military temperature range, radiation hardened).
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The [organization] shall ensure that the contractors/developers have all ASICs designed, developed, manufactured, packaged, and tested by suppliers with a Defense Microelectronics Activity (DMEA) Trust accreditation.{SV-SP-5}{SR-1,SR-5}
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The [organization] shall ensure that the contractors/developers have all EEEE, and mechanical piece parts procured from the Original Component Manufacturer (OCM) or their authorized franchised distribution network.{SV-SP-5}{SR-1,SR-5}
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These requirements might only make sense for ASIC/FPGA that are deemed to support mission critical functions. The Program has the responsibility to identify all ASICs and FPGAs that are used in all flight hardware by each hardware element. This list must include all contractor and subcontractor usage of ASICs and FPGAs.
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The [organization] shall use a DMEA certified environment to develop, code and test executable software (firmware or bit-stream) that will be programmed into a one-time programmable FPGA or be programmed into non-volatile memory (NVRAM) that the FPGA executes.{SV-SP-5}{SR-1,SR-5}
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DOD-I-5200.44 requires the following:
4.c.2 “Control the quality, configuration, and security of software, firmware, hardware, and systems throughout their lifecycles... Employ protections that manage risk in the supply chain… (e.g., integrated circuits, field-programmable gate arrays (FPGA), printed circuit boards) when they are identifiable (to the supplier) as having a DOD end-use. “ 4.e “In applicable systems, integrated circuit-related products and services shall be procured from a Trusted supplier accredited by the Defense Microelectronics Activity (DMEA) when they are custom-designed, custommanufactured, or tailored for a specific DOD military end use (generally referred to as application-specific integrated circuits (ASIC)). “ 1.g “In coordination with the DOD CIO, the Director, Defense Intelligence Agency (DIA), and the Heads of the DOD Components, develop a strategy for managing risk in the supply chain for integrated circuit-related products and services (e.g., FPGAs, printed circuit boards) that are identifiable to the supplier as specifically created or modified for DOD (e.g., military temperature range, radiation hardened).
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