Use a dual layered case with the inner layer a highly conducting surface and the outer layer made of a non-conducting material. When heat is generated from internal computing components, the inner, highly conducting surface will quickly dissipate the heat around. The outer layer prevents accesses to the temporary hot spots formed on the inner layer.
|EXF-0002||Side-Channel Attack||Threat actors may use a side-channel attack attempts to gather information by measuring or exploiting indirect effects of the spacecraft. Information within the spacecraft can be extracted through these side-channels in which sensor data is analyzed in non-trivial ways to recover subtle, hidden or unexpected information. A series of measurements of a side-channel constitute an identifiable signature which can then be matched against a signature database to identify target information, without having to explicitly decode the side-channel.|
|.05||Thermal Imaging attacks||Threat actors can leverage thermal imaging attacks (e.g., infrared images) to measure heat that is emitted as a means to exfiltrate information from spacecraft processors. Thermal attacks rely on temperature profiling using sensors to extract critical information from the chip(s). The availability of highly sensitive thermal sensors, infrared cameras, and techniques to calculate power consumption from temperature distribution  has enhanced the effectiveness of these attacks. As a result, side-channel attacks can be performed by using temperature data without measuring power pins of the chip.|
|SV-AC-5||Proximity operations (i.e., grappling satellite)|