Dual Layer Protection

Use a dual layered case with the inner layer a highly conducting surface and the outer layer made of a non-conducting material. When heat is generated from internal computing components, the inner, highly conducting surface will quickly dissipate the heat around. The outer layer prevents accesses to the temporary hot spots formed on the inner layer.

Sources

NIST Rev5 Controls

D3FEND Techniques

D3FEND Artifacts

None

ISO 27001

NASA Best Practice Guide

ESA Space Shield Mitigation

Related MITRE EMB3D Mitigations

Related CSF 2.0

Related BSI Security Measures

ID: CM0064
Tier: III
Onboard SV CM 
Created: 2022/10/19
Last Modified: 2023/10/17