Dual Layer Protection

Use a dual layered case with the inner layer a highly conducting surface and the outer layer made of a non-conducting material. When heat is generated from internal computing components, the inner, highly conducting surface will quickly dissipate the heat around. The outer layer prevents accesses to the temporary hot spots formed on the inner layer.

Sources

https://www.cse.msu.edu/~alexliu/publications/SensorSideChannel/SensorSideChannel.pdf

Best Segment for Countermeasure Deployment

Space Segment

NIST Rev5 Controls

D3FEND Techniques

D3FEND Artifacts

None

ISO 27001

NASA Best Practice Guide

ESA Space Shield Mitigation

None

Related MITRE EMB3D Mitigations

No related MITRE EMB3D Mitigations

ID: CM0064

Created: 2022/10/19

Last Modified: 2023/10/17

Techniques Addressed by Countermeasure

ID		Name	Description
EXF-0002		Side-Channel Exfiltration	Threat actors may use a side-channel attack attempts to gather information by measuring or exploiting indirect effects of the spacecraft. Information within the spacecraft can be extracted through these side-channels in which sensor data is analyzed in non-trivial ways to recover subtle, hidden or unexpected information. A series of measurements of a side-channel constitute an identifiable signature which can then be matched against a signature database to identify target information, without having to explicitly decode the side-channel.
	.05	Thermal Imaging attacks	Threat actors can leverage thermal imaging attacks (e.g., infrared images) to measure heat that is emitted as a means to exfiltrate information from spacecraft processors. Thermal attacks rely on temperature profiling using sensors to extract critical information from the chip(s). The availability of highly sensitive thermal sensors, infrared cameras, and techniques to calculate power consumption from temperature distribution [7] has enhanced the effectiveness of these attacks. As a result, side-channel attacks can be performed by using temperature data without measuring power pins of the chip.

ID	Description
SV-AC-5	Proximity operations (i.e., grappling satellite)

Sample Requirements

Requirement	Rationale/Additional Guidance/Notes
The [spacecraft] shall protect system components, associated data communications, and communication buses in accordance with: (i) national emissions and TEMPEST policies and procedures, and (ii) the security category or sensitivity of the transmitted information.{SV-CF-2,SV-MA-2}{PE-14,PE-19,PE-19(1),RA-5(4),SA-8(18),SA-8(19),SC-8(1)}	The measures taken to protect against compromising emanations must be in accordance with DODD S-5200.19, or superseding requirements. The concerns addressed by this control during operation are emanations leakage between multiple payloads within a single space platform, and between payloads and the bus.
The [organization] shall describe (a) the separation between RED and BLACK cables, (b) the filtering on RED power lines, (c) the grounding criteria for the RED safety grounds, (d) and the approach for dielectric separators on any potential fortuitous conductors.{SV-CF-2,SV-MA-2}{PE-19,PE-19(1)}
The [spacecraft] shall be designed such that it protects itself from information leakage due to electromagnetic signals emanations.{SV-CF-2,SV-MA-2}{PE-19,PE-19(1),RA-5(4),SA-8(19)}	This requirement applies if system components are being designed to address EMSEC and the measures taken to protect against compromising emanations must be in accordance with DODD S-5200.19, or superseding requirements.